- 专利标题： Polishing table replacement apparatus, polishing table replacement method, and apparatus for replacing a component of semiconductor-device manufacturing machine
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申请号： US15309508申请日： 2015-05-11
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公开(公告)号： US09908212B2公开(公告)日： 2018-03-06
- 发明人: Shuichi Suemasa , Hiroyuki Shinozaki , Yutaka Kobayashi
- 申请人： Ebara Corporation
- 申请人地址： JP Tokyo
- 专利权人： Ebara Corporation
- 当前专利权人： Ebara Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Leydig, Voit & Mayer, Ltd.
- 优先权： JP2014-100384 20140514; JP2015-048837 20150311
- 国际申请： PCT/JP2015/063500 WO 20150511
- 国际公布： WO2015/174375 WO 20151119
- 主分类号： B24B37/34
- IPC分类号： B24B37/34 ; B24B37/20 ; H01L21/304
摘要：
An apparatus for replacing a polishing table, which is used in a polishing apparatus for polishing a substrate such as wafer, is disclosed. The polishing table replacement apparatus (10) is used for removing a polishing table (3) from a polishing apparatus (1). This polishing table replacement apparatus (10) includes a crane (10) configured to move the polishing table (3) vertically and horizontally, a table stage (14) on which the polishing table (3) can be placed, and a table-stage tilting mechanism (15) configured to tilt the table stage (14).
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