- 专利标题: Methods, systems, and articles of manufacture for implementing an electronic design with solid-fluid analysis driven techniques
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申请号: US15199822申请日: 2016-06-30
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公开(公告)号: US09910947B1公开(公告)日: 2018-03-06
- 发明人: Chun-Teh Kao , An-Yu Kuo
- 申请人: Cadence Design Systems, Inc.
- 申请人地址: US CA San Jose
- 专利权人: Cadence Design Systems, Inc.
- 当前专利权人: Cadence Design Systems, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Vista IP Law Group, LLP
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
The described techniques implement electronic designs with thermal analyses of the electronic design and its surrounding medium by performing thermal modeling that determines at least a thermal RC network for an electronic design. These techniques further generate a thermal network for the electronic design and one or more surrounding media of the electronic design and generate or modify the electronic design with an implementation process at least by guiding the implementation process based in part or in whole upon results of performing one or more thermal analysis on the thermal network.
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