Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US14043058Application Date: 2013-10-01
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Publication No.: US09911625B2Publication Date: 2018-03-06
- Inventor: Shunpei Yamazaki , Junichi Koezuka
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2010-042024 20100226
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L21/385 ; H01L29/66

Abstract:
In a transistor including an oxide semiconductor layer, an oxide insulating layer is formed so as to be in contact with the oxide semiconductor layer. Then, oxygen is introduced (added) to the oxide semiconductor layer through the oxide insulating layer, and heat treatment is performed. Through these steps of oxygen introduction and heat treatment, impurities such as hydrogen, moisture, a hydroxyl group, or hydride are intentionally removed from the oxide semiconductor layer, so that the oxide semiconductor layer is highly purified.
Public/Granted literature
- US09099428B2 Method for manufacturing semiconductor device Public/Granted day:2015-08-04
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