- 专利标题： Land structure for semiconductor package and method therefor
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申请号： US15043572申请日： 2016-02-14
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公开(公告)号： US09911685B2公开(公告)日： 2018-03-06
- 发明人: Kyoung Yeon Lee , Byong Jin Kim , Jae Min Bae , Hyung Il Jeon , Gi Jeong Kim , Ji Young Chung
- 申请人： Amkor Technology, Inc.
- 申请人地址： US AZ Tempe
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Tempe
- 代理商 Kevin B. Jackson
- 优先权： KR10-2012-0126438 20121109
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48 ; H01L23/31 ; H01L21/56 ; H01L23/498 ; H01L21/60
摘要：
In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.
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