Invention Grant
- Patent Title: Conductive structures, systems and devices including conductive structures and related methods
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Application No.: US15393553Application Date: 2016-12-29
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Publication No.: US09911692B2Publication Date: 2018-03-06
- Inventor: Michael A. Smith , Eric H. Freeman
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/522 ; H01L27/11548 ; H01L27/11556 ; H01L27/11575 ; H01L27/11582 ; H01L21/768

Abstract:
Conductive structures include a plurality of conductive steps and a contact extending at least partially therethrough in communication with at least one of the plurality of conductive steps and insulated from at least another one of the conductive steps. Devices may include such conductive structures. Systems may include a semiconductor device and a stair step conductive structure having a plurality of contacts extending through a step of the stair step conductive structure. Methods of forming conductive structures include forming contacts in contact holes formed through at least one conductive step of a conductive structure. Methods of forming electrical connections in stair step conductive structures include forming contacts in contact holes formed through each step of the stair step conductive structure.
Public/Granted literature
- US20170110402A1 CONDUCTIVE STRUCTURES, SYSTEMS AND DEVICES INCLUDING CONDUCTIVE STRUCTURES AND RELATED METHODS Public/Granted day:2017-04-20
Information query
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