A structure consisting of at least one die embedded in a polymer matrix and surrounded by the matrix, and further consisting of at least one through via through the polymer matrix around perimeter of the die, wherein typically the at least one via has both ends exposed and where the die is surrounded by a frame of a first polymer matrix and the at least one through via passes through the frame; the die is positioned with terminals on a lower surface such that the lower surface of the chip is coplanar with a lower surface of the frame, the frame is thicker than the chip, and metal is directly attached to and covers at least part of the upper surface of the chip.