Invention Grant
- Patent Title: Conductive pillar shaped for solder confinement
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Application No.: US15403797Application Date: 2017-01-11
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Publication No.: US09911708B2Publication Date: 2018-03-06
- Inventor: Charles L. Arvin , Jeffrey P. Gambino , Christopher D. Muzzy , Wolfgang Sauter
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Sherman IP LLP
- Agent Kenneth L. Sherman; Steven Laut
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00
Abstract:
A method of fabricating a pillar-type connection includes forming, on a bond pad, a first conductive layer including a hollow core. A second conductive layer is formed on a first conductive layer to define a conductive pillar that includes a non-planar top surface defining a recess aligned with the hollow core.
Public/Granted literature
- US20170125368A1 CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT Public/Granted day:2017-05-04
Information query
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