Invention Grant
- Patent Title: Manufacturing method of semiconductor device comprising oxide semiconductor
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Application No.: US15399154Application Date: 2017-01-05
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Publication No.: US09911767B2Publication Date: 2018-03-06
- Inventor: Junichi Koezuka , Naoto Yamade , Yuhei Sato , Yutaka Okazaki , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2011-100040 20110427
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/12 ; H01L29/786 ; H01L21/02 ; H01L29/66 ; H01L21/383 ; H01L21/44 ; H01L21/477

Abstract:
A semiconductor device using an oxide semiconductor is provided with stable electric characteristics to improve the reliability. In a manufacturing process of a transistor including an oxide semiconductor film, an oxide semiconductor film containing a crystal having a c-axis which is substantially perpendicular to a top surface thereof (also called a first crystalline oxide semiconductor film) is formed; oxygen is added to the oxide semiconductor film to amorphize at least part of the oxide semiconductor film, so that an amorphous oxide semiconductor film containing an excess of oxygen is formed; an aluminum oxide film is formed over the amorphous oxide semiconductor film; and heat treatment is performed thereon to crystallize at least part of the amorphous oxide semiconductor film, so that an oxide semiconductor film containing a crystal having a c-axis which is substantially perpendicular to a top surface thereof (also called a second crystalline oxide semiconductor film) is formed.
Public/Granted literature
- US20170117305A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2017-04-27
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