Invention Grant
- Patent Title: Creation of cut files to fit a large package flat on one or more substrates
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Application No.: US14714655Application Date: 2015-05-18
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Publication No.: US09916402B2Publication Date: 2018-03-13
- Inventor: Reiner Eschbach , Stephen C. Morgana
- Applicant: Xerox Corporation
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Fox Rothschild LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A package design system creates one or more package design files by creating cut line instructions and fold line instructions for a package flat. If the system determines that the package flat should be split into two or more subparts across two or more substrates or two or more sub-regions of a single substrate, it will select a fold line and convert the selected fold line to a seam. Conversion to a seam may occur by creating cut line instructions for the selected fold line, imparting a first set of functional elements on a first side of the seam, and imparting a second set of functional elements on a second side of the seam. The first set of functional elements and the second set of functional elements will form a functional connection when the three-dimensional structure is formed.
Public/Granted literature
- US20160342712A1 CREATION OF CUT FILES TO FIT A LARGE PACKAGE FLAT ON ONE OR MORE SUBSTRATES Public/Granted day:2016-11-24
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