Invention Grant
- Patent Title: Semiconductor structure with airgap
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Application No.: US15437736Application Date: 2017-02-21
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Publication No.: US09917005B2Publication Date: 2018-03-13
- Inventor: Mark D. Jaffe , Alvin J. Joseph , Qizhi Liu , Anthony K. Stamper
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Steven J. Meyers; Andrew M. Calderon
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/306 ; H01L29/06

Abstract:
A field effect transistor (FET) with an underlying airgap and methods of manufacture are disclosed. The method includes forming an amorphous layer at a predetermined depth of a substrate. The method further includes forming an airgap in the substrate under the amorphous layer. The method further includes forming a completely isolated transistor in an active region of the substrate, above the amorphous layer and the airgap.
Public/Granted literature
- US20170170056A1 SEMICONDUCTOR STRUCTURE WITH AIRGAP Public/Granted day:2017-06-15
Information query
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