Invention Grant
- Patent Title: Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
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Application No.: US15220455Application Date: 2016-07-27
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Publication No.: US09917282B2Publication Date: 2018-03-13
- Inventor: Akihiro Chida
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2015-150777 20150730; JP2016-119834 20160616
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L51/00 ; H01L51/52
Abstract:
A highly reliable light-emitting device is provided. A yield in a manufacturing process of a light-emitting device is increased. A light-emitting device is provided in which a non-light-emitting portion having a frame-like shape outside a light-emitting portion includes a portion thinner than the light-emitting portion. A light-emitting element and a bonding layer are formed over a substrate. The light-emitting element is sealed by overlapping a pair of substrates and curing the bonding layer. Then, while the cured bonding layer is heated, pressure is applied to at least a portion of the non-light-emitting portion with a member having a projection.
Public/Granted literature
- US20170033323A1 MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE, MODULE, AND ELECTRONIC DEVICE Public/Granted day:2017-02-02
Information query
IPC分类:
