Invention Grant
- Patent Title: Manufacturing method for laminated electronic component
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Application No.: US14520386Application Date: 2014-10-22
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Publication No.: US09922765B2Publication Date: 2018-03-20
- Inventor: Takashi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-223257 20131028; JP2014-168073 20140821
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/12 ; H01G4/30 ; H01G4/248 ; H01G4/35 ; H01G4/232 ; B32B38/04
Abstract:
In a method of manufacturing a laminated electronic component, in a step of obtaining a laminate, a position of a second green sheet with respect to a first green sheet is determined such that an overall width of a first portion printed on the first green sheet and a second portion printed on the second green sheet becomes substantially equal to a width of the first portion or a width of the second portion.
Public/Granted literature
- US20150116900A1 LAMINATED ELECTRONIC COMPONENT MANUFACTURING METHOD, AND LAMINATED ELECTRONIC COMPONENT Public/Granted day:2015-04-30
Information query
