- 专利标题： Package structure with dummy die
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申请号： US15268843申请日： 2016-09-19
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公开(公告)号： US09922964B1公开(公告)日： 2018-03-20
- 发明人: Hsien-Wei Chen , Li-Hsien Huang
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/498 ; H01L23/31 ; H01L25/10 ; H01L25/065 ; H01L23/00 ; H01L25/00
摘要：
A package structure and method for forming the same are provided. The package structure includes a substrate, and a device die formed over the substrate. The device die has a first height. The package structure includes a dummy die formed over the substrate and adjacent to the device die, and the dummy die has a second height. The second height is smaller than the first height. The package structure also includes a package layer formed between the device die and the dummy die.
公开/授权文献
- US20180082987A1 PACKAGE STRUCTURE WITH DUMMY DIE 公开/授权日：2018-03-22
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