Invention Grant
- Patent Title: Insulating structure, a method of forming an insulating structure, and a chip scale isolator including such an insulating structure
-
Application No.: US13788410Application Date: 2013-03-07
-
Publication No.: US09929038B2Publication Date: 2018-03-27
- Inventor: Laurence Brendan O'Sullivan
- Applicant: Analog Devices Global
- Applicant Address: BM Hamilton
- Assignee: Analog Devices Global
- Current Assignee: Analog Devices Global
- Current Assignee Address: BM Hamilton
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L21/762 ; H01L29/06 ; H01L23/31 ; H01L23/495 ; H01L23/50
Abstract:
A method of forming an insulating structure, comprising forming an insulating region comprising at least one electrical or electronic component or part thereof embedded within the insulating region, and forming a surface structure in a surface of the insulating region.
Public/Granted literature
Information query
IPC分类:
