Invention Grant
- Patent Title: Fan-out package structure having embedded package substrate
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Application No.: US15203418Application Date: 2016-07-06
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Publication No.: US09941260B2Publication Date: 2018-04-10
- Inventor: Tzu-Hung Lin , Chi-Chin Lien , Nai-Wei Liu , I-Hsuan Peng , Ching-Wen Hsiao , Wei-Che Huang
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/10 ; H01L25/00 ; H01L23/498 ; H01L23/538 ; H01L25/065

Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a first semiconductor package that includes a first semiconductor die having a first surface and a second surface opposite thereto. A first package substrate is disposed on the first surface of the first semiconductor die. A first molding compound surrounds the first semiconductor die and the first package substrate. A first redistribution layer (RDL) structure is disposed on the first molding compound, in which the first package substrate is interposed and electrically coupled between the first semiconductor die and the first RDL structure.
Public/Granted literature
- US20170077073A1 FAN-OUT PACKAGE STRUCTURE HAVING EMBEDDED PACKAGE SUBSTRATE Public/Granted day:2017-03-16
Information query
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