Invention Grant
- Patent Title: Semiconductor structure having fins and method for manufacturing the same
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Application No.: US15226007Application Date: 2016-08-02
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Publication No.: US09941279B2Publication Date: 2018-04-10
- Inventor: Kuo-Cheng Ching , Shi-Ning Ju , Chih-Hao Wang , Ying-Keung Leung , Carlos H. Diaz
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/308
- IPC: H01L21/308 ; H01L21/8234 ; H01L29/78 ; H01L27/088 ; H01L29/06 ; H01L21/762 ; H01L27/108 ; H01L21/3065

Abstract:
A semiconductor structure includes a substrate, at least one active fin present on the substrate, and at least one isolation dielectric surrounding the active fin. The isolation dielectric has at least one trench therein. The semiconductor structure further includes at least one dielectric liner present on at least one sidewall of the trench of the isolation dielectric, and at least one filling dielectric present in the trench of the isolation dielectric.
Public/Granted literature
- US20170338225A1 SEMICONDUCTOR STRUCTURE HAVING FINS AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-11-23
Information query
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