- 专利标题: Semiconductor device
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申请号: US15409033申请日: 2017-01-18
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公开(公告)号: US09941281B2公开(公告)日: 2018-04-10
- 发明人: Jung-Gun You , Hyung-Jong Lee , Sung-Min Kim , Chong-Kwang Chang
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2015-0046761 20150402
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L23/485 ; H01L23/528 ; H01L23/532 ; H01L29/06
摘要:
A semiconductor device, including first and second fin patterns separated by a first trench; a gate electrode intersecting the first and second fin patterns; and a contact on at least one side of the gate electrode, the contact contacting the first fin pattern, the contact having a bottom surface that does not contact the second fin pattern, a height from a bottom of the first trench to a topmost end of the first fin pattern in a region in which the contact intersects the first fin pattern being a first height, and a height from the bottom of the first trench to a topmost end of the second fin pattern in a region in which an extension line of the contact extending along a direction in which the gate electrode extends intersects the second fin pattern being a second height, the first height being smaller than the second height.
公开/授权文献
- US20170133370A1 SEMICONDUCTOR DEVICE 公开/授权日:2017-05-11
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