- 专利标题： Method of manufacturing an image sensor by joining a pixel circuit substrate and a logic circuit substrate and thereafter thinning the pixel circuit substrate
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申请号： US14989508申请日： 2016-01-06
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公开(公告)号： US09941326B2公开(公告)日： 2018-04-10
- 发明人: Nobutoshi Fujii , Kenichi Aoyagi , Yoshiya Hagimoto , Hayato Iwamoto
- 申请人： Sony Corporation
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Dentons US LLP
- 优先权： JP2012-007086 20120117; JP2012-007087 20120117; JP2012-007088 20120117
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L27/146 ; H01L25/00 ; H01L31/18 ; H01L25/065
摘要：
The present technology includes: bonding a device formation side of a first substrate having a first device and a device formation side of a second substrate having a second device in opposition to each other; forming a protective film on at least an edge of the second substrate having the second device; and reducing a thickness of the first substrate.
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