Speaker assemblies for a headphone device may include an audio speaker configured to produce audible sound in response to receiving an audio signal at the audio speaker. A tactile bass vibrator distinct from the audio speaker may be operatively connected to the audio speaker. The tactile bass vibrator may be configured to produce tactile vibrations in response to receiving the audio signal at the tactile bass vibrator. A current divider may be operatively connected to the audio speaker and the tactile bass vibrator. A pivoting portion of an attachment structure of an ear cup supporting the audio speaker, tactile bass vibrator, and current divider may intersect with a geometrical central axis of the ear cup, and the audio speaker and tactile bass vibrator may not intersect with the geometrical central axis of the respective ear cup.