Invention Grant
- Patent Title: Socket interposer having a multi-modal I/O interface
-
Application No.: US14454309Application Date: 2014-08-07
-
Publication No.: US09946664B2Publication Date: 2018-04-17
- Inventor: Ian P. Shaeffer , Zhan Ping
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Convergent Law Group LLP
- Main IPC: G06F13/12
- IPC: G06F13/12 ; G06F13/40 ; G11C7/10

Abstract:
Exemplary embodiments include a socket interposer having a plurality of connectors configured to attach to a server board, the server board including: a first processor socket having a processor form factor, and a first memory associated with the first processor socket, a processor inserted into the at least first processor socket, the processor having access to the first memory, and a second processor socket having the processor form factor, and a second memory associated with the second processor socket, wherein the plurality of connectors are configured to fit the processor form factor; and a multi-modal I/O interface having a first mode and a second mode, wherein in the first mode provides processor-to-processor communication, and the second mode provides the first processor with accessibility to the second memory associated with the second processor socket.
Public/Granted literature
- US20150134868A1 SOCKET INTERPOSER HAVING A MULTI-MODAL I/O INTERFACE Public/Granted day:2015-05-14
Information query