- 专利标题: Surface acoustic wave device
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申请号: US14541180申请日: 2014-11-14
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公开(公告)号: US09948274B2公开(公告)日: 2018-04-17
- 发明人: Keiichi Umeda , Ryo Nakagawa , Atsushi Tanaka
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2012-113171 20120517
- 主分类号: H01L41/047
- IPC分类号: H01L41/047 ; H03H9/02 ; H01L41/16
摘要:
A surface acoustic wave device includes a high acoustic velocity film in which a transversal wave propagates at a higher acoustic velocity than in a ScAlN film laminated on a substrate made of silicon or glass. The ScAlN film is laminated on the high acoustic velocity film, and IDT electrodes are laminated on the ScAlN film.
公开/授权文献
- US20150069882A1 SURFACE ACOUSTIC WAVE DEVICE 公开/授权日:2015-03-12
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