Invention Grant
- Patent Title: Hybrid chip comprising hybrid connector
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Application No.: US15211459Application Date: 2016-07-15
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Publication No.: US09948301B2Publication Date: 2018-04-17
- Inventor: Sangwook Han , Thomas Byunghak Cho , Jaehyun Lim , Sung-Jun Lee , Joonhee Lee , Jongwon Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2015-0105120 20140724; KR10-2016-0069584 20160603
- Main IPC: H03L5/00
- IPC: H03L5/00 ; H03K19/0175 ; H01L27/02

Abstract:
An integrated circuit (IC), a method of testing the IC, and a method of manufacturing the IC are provided. The IC includes analog circuitry, digital circuitry, at least one first connector, and a switching unit operatively coupled with the at least one first connector and configured to, if a first signal is received, couple the analog circuitry and the at least one first connector, and, if a second signal is received, couple the digital circuitry and the at least one first connector.
Public/Granted literature
- US20170026041A1 HYBRID CHIP COMPRISING HYBRID CONNECTOR Public/Granted day:2017-01-26
Information query