Invention Grant
- Patent Title: Common modulus RSA key pairs for signature generation and encryption/decryption
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Application No.: US14616552Application Date: 2015-02-06
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Publication No.: US09949115B2Publication Date: 2018-04-17
- Inventor: Roberto Avanzi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza LLP
- Agent Jae-Hee Choi
- Main IPC: H04L29/06
- IPC: H04L29/06 ; H04W12/04 ; H04L9/30 ; H04L9/08 ; H04L9/32

Abstract:
Various features pertain to embedded key generation and provisioning systems, such as systems installed within smartphones for generating public-key/private-key pairs for use in encryption/decryption and digital signature generation. In some examples, an embedded system is provided that generates two public-key/private-key pairs—one for encryption/decryption and the other for signing/verification—where the two public-key/private-key pairs share a common modulus but are otherwise distinct or uncorrelated. This allows the two key pairs to be generated more efficiently than if two entirely separate key pairs were generated and yet, at least in the context of embedded systems, satisfactory integrity and confidentiality is achieved. Techniques for decrypting and signing messages using common modulus keys are described for use by an embedded component of a mobile device, along with techniques for encrypting and verifying messages for use by a remote system such as a key provisioning server of a partner software vendor.
Public/Granted literature
- US20160043870A1 COMMON MODULUS RSA KEY PAIRS FOR SIGNATURE GENERATION AND ENCRYPTION/DECRYPTION Public/Granted day:2016-02-11
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