- 专利标题: Effective device formation for advanced technology nodes with aggressive fin-pitch scaling
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申请号: US15402770申请日: 2017-01-10
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公开(公告)号: US09953976B2公开(公告)日: 2018-04-24
- 发明人: Injo Ok , Sanjay C. Mehta , Balasubramanian Pranatharthiharan , Soon-Cheon Seo , Charan V. Surisetty
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Steven J. Meyers
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L27/00 ; H01L29/00 ; H01L27/088 ; H01L21/8234 ; H01L29/78 ; H01L29/66 ; H01L21/283 ; H01L21/311
摘要:
After forming a gate stack straddling a portion of each semiconductor fin of a plurality of semiconductor fins located over a substrate, a gate liner is formed on sidewalls of a lower portion of the gate stack that contacts the plurality of semiconductor fins and a gate spacer having a width greater than a width of the gate liner is formed on sidewalls of an upper portion of the gate stack that is located above the plurality of semiconductor fins. The width of the gate spacer thus is not limited by the fin pitch, and can be optimized to improve the device performance.
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