Invention Grant
- Patent Title: Frame format for low latency channel bonding
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Application No.: US14946979Application Date: 2015-11-20
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Publication No.: US09954595B2Publication Date: 2018-04-24
- Inventor: Amichai Sanderovich
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, LLP
- Main IPC: H04B7/06
- IPC: H04B7/06 ; H04L27/26 ; H04B7/0452 ; H04L5/00
Abstract:
Certain aspects of the present disclosure provide methods and apparatus for reducing latency in systems including legacy devices by transmitting legacy-decodable preamble information in each of multiple channels and for transmitting preamble information for channel estimation of a multi-channel transmission in gaps between the multiple channels.
Public/Granted literature
- US20160149631A1 FRAME FORMAT FOR LOW LATENCY CHANNEL BONDING Public/Granted day:2016-05-26
Information query
