Invention Grant
- Patent Title: Printed circuit board having reduced loss of electric signal and method of manufacturing the same
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Application No.: US15057518Application Date: 2016-03-01
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Publication No.: US09955579B2Publication Date: 2018-04-24
- Inventor: Hiroyuki Tanabe , Daisuke Yamauchi
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2015-041711 20150303
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K3/18 ; H05K3/40 ; H05K1/02 ; H05K3/38 ; G11B5/48 ; H05K3/00 ; H05K3/28
Abstract:
A printed circuit board includes first and second insulating layers, a wiring trace, a metal thin film, and a connection terminal. The wiring trace is formed on the first insulating layer. The metal thin film is formed on the wiring trace, and has a thickness larger than 0 nm and not more than 150 nm. The second insulating layer is formed on the first insulating layer to cover the metal thin film. The connection terminal is formed on the first insulating layer to be electrically connected to the wiring trace and exposed from the second insulating layer.
Public/Granted literature
- US20160262265A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-09-08
Information query
