A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.