Invention Grant
- Patent Title: Modified interface around a hole
-
Application No.: US14356464Application Date: 2012-09-14
-
Publication No.: US09957809B2Publication Date: 2018-05-01
- Inventor: Christian Amann , Thomas Beck , Björn Beckmann , Andreas Böttcher , Winfried Esser , Giuseppe Gaio , Rudolf Küperkoch , Eckart Schumann , Rostislav Teteruk
- Applicant: Christian Amann , Thomas Beck , Björn Beckmann , Andreas Böttcher , Winfried Esser , Giuseppe Gaio , Rudolf Küperkoch , Eckart Schumann , Rostislav Teteruk
- Applicant Address: DE Munich
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE Munich
- Agency: Beusse Wolter Sanks & Maire
- Priority: EP11190431 20111124
- International Application: PCT/EP2012/068058 WO 20120914
- International Announcement: WO2013/075858 WO 20130530
- Main IPC: B32B3/24
- IPC: B32B3/24 ; F01D5/18 ; F01D5/28
Abstract:
A layer system including a substrate and a layer is provided. The layer system has a hole at least in the layer, and wherein at least one recess is present in a surface of the layer in a vicinity around the hole or directly adjoining a boundary line of the hole.
Public/Granted literature
- US20140349065A1 MODIFIED INTERFACE AROUND A HOLE Public/Granted day:2014-11-27
Information query
