- 专利标题: Packaging structure of a magnetic device
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申请号: US14941647申请日: 2015-11-15
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公开(公告)号: US09959965B2公开(公告)日: 2018-05-01
- 发明人: Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
- 申请人: CYNTEC CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: CYNTEC CO., LTD.
- 当前专利权人: CYNTEC CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Litron Patent & Trademark Office
- 代理商 Min-Lee Teng
- 主分类号: H01F27/02
- IPC分类号: H01F27/02 ; H01F27/29 ; H01F27/24 ; H01F17/04 ; H01F27/255 ; H01F27/28 ; H01F1/147
摘要:
An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.
公开/授权文献
- US20160141087A1 PACKAGING STRUCTURE OF A MAGNETIC DEVICE 公开/授权日:2016-05-19
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