Invention Grant
- Patent Title: Methods and apparatus for nodule control in a titanium-tungsten target
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Application No.: US14587967Application Date: 2014-12-31
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Publication No.: US09960023B2Publication Date: 2018-05-01
- Inventor: Junqi Wei , Zhitao Cao , Yueh Sheng Ow , Ananthkrishna Jupudi , Kirankumar Savandaiah , Xin Wang , Sriskantharajah Thirunavukarasu
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34 ; C22C1/04 ; C22C27/04 ; B22F3/12 ; C22C14/00

Abstract:
Embodiments of the present disclosure include methods and apparatus for controlling titanium-tungsten (TiW) target nodule formation. In some embodiments, a target includes: a source material comprising predominantly titanium (Ti) and tungsten (W), formed from a mixture of titanium powder and tungsten powder, wherein a grain size of a predominant quantity of the titanium powder is less than or equal to a grain size of a predominant quantity of the tungsten powder.
Public/Granted literature
- US20160189941A1 METHODS AND APPARATUS FOR NODULE CONTROL IN A TITANIUM-TUNGSTEN TARGET Public/Granted day:2016-06-30
Information query
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