Invention Grant
- Patent Title: Heat pump hot-water supply device and method for controlling a heat pump hot-water supply device
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Application No.: US14876288Application Date: 2015-10-06
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Publication No.: US09964341B2Publication Date: 2018-05-08
- Inventor: Junhyeon Hwang
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2015-0013639 20150128
- Main IPC: F25B1/00
- IPC: F25B1/00 ; F25B49/00 ; F25B13/00 ; F25B49/02 ; F25B30/02 ; F28D9/00 ; F24H4/02 ; F24H9/20 ; F28D21/00

Abstract:
A heat pump hot-water supply device and a method for controlling a heat pump hot-water supply device are provided. The heat pump hot-water supply device may include a first refrigerant cycle, in which a first refrigerant may circulate, the first refrigerant cycle including a first compressor, an outdoor heat exchanger, and a first expansion device; a second refrigerant cycle, in which a second refrigerant may circulate, the second refrigerant cycle including a second compressor and a second expansion device; a water-refrigerant heat exchanger to which the first refrigerant compressed in the first compressor and the second refrigerant compressed in the second compressor may be introduced; a water introduction path coupled to a first side of the water-refrigerant heat exchanger and into which supplied water may be introduced; and a water discharge path coupled to a second side of the water-refrigerant heat exchanger and from which the water heat-exchanged in the refrigerant heat exchanger may be discharged.
Public/Granted literature
- US20160216011A1 HEAT PUMP HOT-WATER SUPPLY DEVICE AND METHOD FOR CONTROLLING A HEAT PUMP HOT-WATER SUPPLY DEVICE Public/Granted day:2016-07-28
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