Invention Grant
- Patent Title: Sensor module and method of manufacture
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Application No.: US15582177Application Date: 2017-04-28
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Publication No.: US09964606B2Publication Date: 2018-05-08
- Inventor: Mark Isler
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Agent Charlene R. Jacobsen
- Priority: EP16169312 20160512
- Main IPC: H01L27/22
- IPC: H01L27/22 ; G01R33/09 ; H01L43/14 ; H01L43/04 ; H01L43/06 ; H01L43/00 ; G01R33/00 ; H01L43/02 ; H01L43/08 ; H01L43/12

Abstract:
According to embodiments there is provided a magneto-resistive sensor module. The sensor module may comprise: an integrated circuit; magneto-resistive sensor elements arranged as a bridge circuit monolithically integrated on the integrated circuit; and a stress buffer layer arranged between the integrated circuit and the magneto-resistive sensor element. There is also a provided a method of manufacturing the magneto-resistive sensor module.
Public/Granted literature
- US20170328964A1 SENSOR MODULE AND METHOD OF MANUFACTURE Public/Granted day:2017-11-16
Information query
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