Invention Grant
- Patent Title: Chip electronic component and manufacturing method thereof
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Application No.: US15049639Application Date: 2016-02-22
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Publication No.: US09966178B2Publication Date: 2018-05-08
- Inventor: Youn-Soo Seo , Myung-Sam Kang , Jin-Soo Kim , Young-Gwan Ko , Woon-Chul Choi , In-Seok Kim , Hye-Yeon Cha
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2015-0024991 20150223
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/255 ; H01F17/00 ; H01F27/32 ; H01F41/04 ; H01F17/04

Abstract:
Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.
Public/Granted literature
- US20160247624A1 CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-08-25
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