- Patent Title: Thin film-type coil component and method of fabricating the same
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Application No.: US14658981Application Date: 2015-03-16
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Publication No.: US09966181B2Publication Date: 2018-05-08
- Inventor: Young Seuck Yoo , Young Ghyu Ahn , Yong Suk Kim , Sung Kwon Wi , Sang Soo Park , Kang Heon Hur
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0146088 20111229
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F5/00 ; H01F27/28 ; H01F17/00 ; H01F41/04

Abstract:
There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance.
Public/Granted literature
- US20150187485A1 THIN FILM-TYPE COIL COMPONENT AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-07-02
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