- 专利标题： Method to transfer two dimensional film grown on metal-coated wafer to the wafer itself in a face-to-face manner
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申请号： US15608525申请日： 2017-05-30
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公开(公告)号： US09966250B2公开(公告)日： 2018-05-08
- 发明人: Kian Ping Loh , Libo Gao , Antonio Helio Castro Neto
- 申请人： National University of Singapore
- 申请人地址： SG Singapore
- 专利权人： National University of Singapore
- 当前专利权人： National University of Singapore
- 当前专利权人地址： SG Singapore
- 代理机构： Hamilton, Brook, Smith & Reynolds, P.C.
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; C30B23/02 ; C30B29/26 ; H01L39/24 ; C30B29/22 ; H01L21/3205
摘要：
A method of in-situ transfer during fabrication of a component comprising a 2-dimensional crystalline thin film on a substrate is disclosed. In one embodiment, the method includes forming a layered structure comprising a polymer, a 2-dimensional crystalline thin film, a metal catalyst, and a substrate. The metal catalyst, being a growth medium for the two-dimensional crystalline thin film, is etched and removed by infiltrating liquid to enable the in-situ transfer of the two-dimensional crystalline thin film directly onto the underlying substrate.
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