Invention Grant
- Patent Title: Hot melt adhesive composition with ethylene/α-olefin multi-block copolymer
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Application No.: US15100497Application Date: 2014-12-22
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Publication No.: US09969912B2Publication Date: 2018-05-15
- Inventor: Colin LiPiShan , Cynthia L. Rickey , Alex Y. Wang
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Husch Blackwell LLP
- International Application: PCT/US2014/071845 WO 20141222
- International Announcement: WO2015/102989 WO 20150709
- Main IPC: C09J157/00
- IPC: C09J157/00 ; C09J153/00 ; C09J123/08
Abstract:
The present disclosure is directed to a hot melt adhesive composition including: a) an ethylene/α-olefin multi-block copolymer having a weight molecular weight (Mw) less than 20,000; b) a tackifier having a softening temperature from 90° C. to 150° C.; and c) a wax.
Public/Granted literature
- US20160304756A1 Hot Melt Adhesive Composition with Ethylene/a-Olefin Multi-Block Copolymer Public/Granted day:2016-10-20
Information query
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