Invention Grant
- Patent Title: Processor and data processing method thereof
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Application No.: US15666817Application Date: 2017-08-02
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Publication No.: US09973209B2Publication Date: 2018-05-15
- Inventor: Tetsuo Kosuge , Doo Hyun Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Nixon & Vanderhye, P.C.
- Priority: KR10-2016-0117361 20160912
- Main IPC: H03M7/00
- IPC: H03M7/00 ; H03M7/30 ; H03M7/40

Abstract:
A processor includes a first encoder configured to encode a regular bin block including at least one regular bin, a second encoder configured to encode a bypass bin block including at least one bypass bin, and a parameter calculating module comprising parameter calculating circuitry configured to determine context information for encoding the regular bin block and to transmit the context information to the first encoder. The first encoder and the second encoder may process the regular bin block and the bypass bin block simultaneously and in parallel during at least part of a specific processing cycle.
Public/Granted literature
- US20180076827A1 PROCESSOR AND DATA PROCESSING METHOD THEREOF Public/Granted day:2018-03-15
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