Invention Grant
- Patent Title: Multipolar lead parts and board coupling device
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Application No.: US15321253Application Date: 2015-09-10
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Publication No.: US09974178B2Publication Date: 2018-05-15
- Inventor: Masakazu Morimoto , Noboru Kaneko , Tadayoshi Osakabe
- Applicant: NSK Ltd.
- Applicant Address: JP Tokyo
- Assignee: NSK LTD.
- Current Assignee: NSK LTD.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-185119 20140911; JP2015-176880 20150908
- International Application: PCT/JP2015/075697 WO 20150910
- International Announcement: WO2016/039413 WO 20160317
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/34

Abstract:
Multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein said rising portion is formed as to have an obtuse angle from said solder coupling portion regardless of a bending angle of said vertical portion with respect to said solder coupling portion.
Public/Granted literature
- US20170208687A1 MULTIPOLAR LEAD PARTS AND BOARD COUPLING DEVICE Public/Granted day:2017-07-20
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