• Patent Title: Multipolar lead parts and board coupling device
  • Application No.: US15321253
    Application Date: 2015-09-10
  • Publication No.: US09974178B2
    Publication Date: 2018-05-15
  • Inventor: Masakazu MorimotoNoboru KanekoTadayoshi Osakabe
  • Applicant: NSK Ltd.
  • Applicant Address: JP Tokyo
  • Assignee: NSK LTD.
  • Current Assignee: NSK LTD.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2014-185119 20140911; JP2015-176880 20150908
  • International Application: PCT/JP2015/075697 WO 20150910
  • International Announcement: WO2016/039413 WO 20160317
  • Main IPC: H05K1/18
  • IPC: H05K1/18 H05K3/34
Multipolar lead parts and board coupling device
Abstract:
Multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein said rising portion is formed as to have an obtuse angle from said solder coupling portion regardless of a bending angle of said vertical portion with respect to said solder coupling portion.
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