Invention Grant
- Patent Title: Methods, devices and systems for sensor with removable nodes
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Application No.: US15212428Application Date: 2016-07-18
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Publication No.: US09974484B2Publication Date: 2018-05-22
- Inventor: Kenneth Kaskoun , Brian David Niznik , Michael David Atella
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Kilpatrick Townsend & Stockton/Qualcomm
- Main IPC: A61B5/00
- IPC: A61B5/00 ; A61B5/11

Abstract:
An integrated adhesive sensor array includes an adhesive a patch, a sensor hub, and a detachable sensor pod packaged as a unit. The patch may include a docking area for the detachable sensor pod. The detachable sensor pod may include at least one sensor and may be configured to be detached from the patch and applied to various locations on a body. The detachable sensor pod may send sensor data to the sensor hub via a wired link when on the patch and via a wireless link when detached from the patch. The sensor hub receives sensor data from the various sensors, and relays the data to a receiver. The sensor hub and detachable sensor pod may include indicators for communicating information. The sensor hub may include a power source for powering the sensor hub and a detachable sensor pod attached to the main sensor unit or patch.
Public/Granted literature
- US20160324472A1 Methods, Devices and Systems for Sensor with Removable Nodes Public/Granted day:2016-11-10
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