Invention Grant
- Patent Title: Atomic-layer deposition apparatus
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Application No.: US15259670Application Date: 2016-09-08
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Publication No.: US09976216B2Publication Date: 2018-05-22
- Inventor: Kurt D. Sieber , Kam Chuen Ng , Ronald Steven Cok
- Applicant: Eastman Kodak Company
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent Kevin E Spaulding
- Main IPC: C23C16/458
- IPC: C23C16/458 ; C23C16/455 ; C23C16/44

Abstract:
A thin film deposition system for depositing a thin film on a moveable substrate using atmospheric pressure atomic-layer deposition includes a chamber and a moveable substrate having a levitation stabilizing structure located on the moveable substrate that defines an enclosed interior impingement area of the moveable substrate. A stationary support, located in the chamber, supports the moveable substrate. The stationary support extends beyond the enclosed interior impingement area. A pressurized-fluid source provides a fluid flow through the stationary support that impinges on the moveable substrate within the enclosed interior impingement area of the moveable substrate sufficient to levitate the moveable substrate and expose the moveable substrate to the fluid while restricting the lateral motion of the moveable substrate with the levitation stabilizing structure.
Public/Granted literature
- US20170051404A1 ATOMIC-LAYER DEPOSITION APPARATUS Public/Granted day:2017-02-23
Information query
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