- 专利标题: Die assembly with cooled die land
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申请号: US13990093申请日: 2010-12-30
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公开(公告)号: US09978482B2公开(公告)日: 2018-05-22
- 发明人: Yongyong Yang , Geoffrey D. Brown , Manish Mundra , Bin Li , Journey Lu Zhu
- 申请人: Yongyong Yang , Geoffrey D. Brown , Manish Mundra , Bin Li , Journey Lu Zhu
- 申请人地址: US MI Midland
- 专利权人: Dow Global Technologies LLC
- 当前专利权人: Dow Global Technologies LLC
- 当前专利权人地址: US MI Midland
- 代理机构: Husch Blackwell LLP
- 国际申请: PCT/CN2010/080515 WO 20101230
- 国际公布: WO2012/088692 WO 20120705
- 主分类号: B29C47/02
- IPC分类号: B29C47/02 ; B29C47/86 ; H01B13/14 ; B29C47/28 ; H01B7/00 ; B29C47/00
摘要:
A die assembly (10) for extruding a polymeric coating onto a wire so as to impart a matte finish to the coating surface is provided. The die assembly (10) comprises: A) a die tip (13) comprising a tubular channel (22) through which a wire can pass, the channel (22) positioned along the central longitudinal axis (26) of the die assembly (10); B) a die body (12) comprising a trunk (15) and a head (16), the head (16) comprising a tubular channel (20), the head tubular channel (20) comprising a die land (21), the trunk (15) positioned about the die tip (13) so as to define an annular space (25) between the exterior surface (23) of the die tip (13) and the interior surface (24) of the trunk (15); C) a die holder (11) positioned about and in contact with the exterior surface (17) of the trunk (15); and D) a radiator (14) positioned about and in contact with the exterior surface (19) of the die land (21) of the die head (16).
公开/授权文献
- US20130264092A1 Die Assembly with Cooled Die Land 公开/授权日:2013-10-10
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