Invention Grant
- Patent Title: Dynamic audio/video channel bonding
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Application No.: US14883075Application Date: 2015-10-14
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Publication No.: US09979599B2Publication Date: 2018-05-22
- Inventor: Rajesh Shankarrao Mamidwar , Xuemin Chen , Victor Hou
- Applicant: Broadcom Corporation
- Applicant Address: SG Singapore
- Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
- Current Assignee: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: McDermott Will & Emery LLP
- Main IPC: H04L12/46
- IPC: H04L12/46 ; H04L12/28 ; H04L12/24 ; H04L12/26 ; H04L5/00 ; H04J3/06 ; H04N21/236 ; H04N21/2365 ; H04N21/2385 ; H04N21/647

Abstract:
A data communication architecture delivers a wide variety of content, including audio and video content, to consumers. The architecture employs channel bonding to deliver more bandwidth than any single communication channel can carry. In some implementations, the communication architecture communicates content according to an initial bonding configuration. The communication architecture may adjust the bonding configuration to adapt to bonding environment changes affecting the communication capabilities or requirements associated with transmitting the content.
Public/Granted literature
- US20160036660A1 Dynamic Audio/Video Channel Bonding Public/Granted day:2016-02-04
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