Invention Grant
- Patent Title: Housing of electronic module, electronic module, light emitting module and backlight module
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Application No.: US14238212Application Date: 2012-08-10
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Publication No.: US09982869B2Publication Date: 2018-05-29
- Inventor: Yaojun Feng , Yuanyuan He , Yubao He , Yabin Luo , Canbang Yang
- Applicant: Yaojun Feng , Yuanyuan He , Yubao He , Yabin Luo , Canbang Yang
- Applicant Address: DE Munich
- Assignee: OSRAM GMBH
- Current Assignee: OSRAM GMBH
- Current Assignee Address: DE Munich
- Agency: Viering Jentschura & Partner MBB
- Priority: CN201110233866 20110815
- International Application: PCT/EP2012/065728 WO 20120810
- International Announcement: WO2013/024046 WO 20130221
- Main IPC: F21V15/00
- IPC: F21V15/00 ; F21V15/01 ; H05K5/02 ; F21S4/24 ; G02F1/1335 ; F21Y115/10
Abstract:
A housing of an electronic module may include: a mounting surface located at one side of the housing, wherein the mounting surface includes at least three sub-mounting surfaces, lines connecting the centers of respective sub-mounting surfaces form a polygon, and a mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon.
Public/Granted literature
- US20140307419A1 HOUSING OF ELECTRONIC MODULE, ELECTRONIC MODULE, LIGHT EMITTING MODULE AND BACKLIGHT MODULE Public/Granted day:2014-10-16
Information query
