Invention Grant
- Patent Title: High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations
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Application No.: US15586928Application Date: 2017-05-04
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Publication No.: US09984948B2Publication Date: 2018-05-29
- Inventor: David Guillon , Heinz Lendenmann , Hui Huang
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Whitmyer IP Group LLC
- Priority: EP16174555 20160615
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L23/06 ; H01L29/739 ; H01L23/31 ; H01L23/051
Abstract:
A power electronics module includes: a baseplate, a power semiconductor chip arranged on the baseplate, and an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.
Public/Granted literature
- US20170365535A1 High Voltage Power Electronics Module For Subsea Applications Public/Granted day:2017-12-21
Information query
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