Invention Grant
- Patent Title: Arrangements and assembly methods for a media binder and its components
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Application No.: US14123022Application Date: 2011-05-31
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Publication No.: US09987870B2Publication Date: 2018-06-05
- Inventor: Eric Hoarau , Tze-Ying Sarah Ni , Gary J. Dispoto
- Applicant: Eric Hoarau , Tze-Ying Sarah Ni , Gary J. Dispoto
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Mannava & Kang, P.C.
- International Application: PCT/US2011/038647 WO 20110531
- International Announcement: WO2012/166128 WO 20121206
- Main IPC: B42D1/00
- IPC: B42D1/00 ; B42D19/00 ; B42D5/00 ; B42D3/00 ; B42D15/00 ; B42F3/00 ; B42F13/02 ; B42F13/06 ; B42F13/08 ; B42F3/02 ; B42F13/12 ; B42F13/00 ; B42C7/00 ; B42F9/00 ; B42D1/08 ; B42D1/02 ; B42F1/00
![Arrangements and assembly methods for a media binder and its components](/abs-image/US/2018/06/05/US09987870B2/abs.jpg.150x150.jpg)
Abstract:
A media binder has an inner assembly and a case assembly, The inner assembly includes inside boards pre-attached to a binding mechanism. Adhesive is placed on outward surfaces of the inside boards. The case assembly includes a cover sheet with at least one marginal edge attached to surface boards and at least one loose edge. To customize cover, a printed cover is inserted in-between the cover sheet and the surface board through an opening formed by the loose edge. The case assembly is then laminated. The laminated case assembly is combined with the inner assembly using the adhesive on the inside boards. A one-piece media binder has cover sheets wrapping around surface boards forming pockets. The surface boards are partially attached to paste downs. To customize cover, printed covers are inserted into the pockets, and the paste downs are then attached to the surface boards to seal loose edges.
Public/Granted literature
- US20140125048A1 ARRANGEMENTS AND ASSEMBLY METHODS FOR A MEDIA BINDER AND ITS COMPONENTS Public/Granted day:2014-05-08
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