An exemplary embodiment discloses an imprint lithography method including: forming a first imprint pattern on a base substrate in a first area; forming a first resist pattern on the base substrate in a second area, the second area partially overlapping the first area; etching a third area using the first imprint pattern and the first resist pattern as an etch barrier, wherein the third area is a portion of the first area that is not overlapped with the second area; removing the first imprint pattern and the first resist pattern; forming a second imprint pattern on the base substrate in a fourth area which overlaps the second area and partially overlaps the third area; forming a second resist pattern on the base substrate in the third area; and etching the second area using the second imprint pattern and the second resist pattern as an etch barrier.