An MEMS microphone is provided in the present disclosure. The MEMS microphone includes a protective structure comprising a housing and a PCB substrate covering the housing to form a receiving space, the housing is provided with a sound hole, an MEMS chip with a back cavity, received in the receiving space and fixed on the PCB substrate, the back cavity is communicated with the sound hole, and the MEMS chip comprises a first surface away from the PCB substrate and a second surface opposite to the first surface; and a waterproof part, bonded to the first surface of the MEMS chip.