Invention Grant
- Patent Title: Integrated circuit modeling method using resistive capacitance information
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Application No.: US14543352Application Date: 2014-11-17
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Publication No.: US09996643B2Publication Date: 2018-06-12
- Inventor: Chin-Sheng Chen , Tsun-Yu Yang , Wei-Yi Hu , Jui-Feng Kuan , Ching-Shun Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of modeling an integrated circuit comprises generating a schematic of an integrated circuit comprising a first circuit component. The schematic comprises a first representation of the first circuit component. The method also comprises replacing the first representation with a second representation of the first circuit component. The second representation includes resistive capacitance information (RC) for the first circuit component. The RC information is based on first RC data included in a process design kit (PDK) file and second RC data included in a macro device file. The second RC data is based on a relationship between the first circuit component and a second circuit component. The method further comprises selectively coloring the second representation of the first circuit component in the schematic based on the RC information. The coloring of the second representation is indicative of whether the integrated circuit is in compliance with a design specification.
Public/Granted literature
- US20160140271A1 INTEGRATED CIRCUIT MODELING METHOD Public/Granted day:2016-05-19
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