- Patent Title: Method of optimizing wire RC for device performance and reliability
-
Application No.: US14872302Application Date: 2015-10-01
-
Publication No.: US09997408B2Publication Date: 2018-06-12
- Inventor: Lawrence A. Clevenger , Baozhen Li , Kirk D. Peterson , John E. Sheets, II , Terry A. Spooner
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb & Riley, LLC
- Agent Steven J. Meyers, Esq.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/768 ; G06F17/50 ; H01L21/66

Abstract:
A method of tailoring BEOL RC parametrics to improve chip performance. According to the method, an integrated circuit design on an integrated circuit chip is analyzed. The analysis comprises calculating Vmax for vias and metal lines in the integrated circuit design over a range of sizes for the vias and the metal lines. Predicted use voltage for applications on the integrated circuit chip is determined. The size or the location of at least one of the vias and the metal lines is tailored based on performance parameters of the integrated circuit chip.
Public/Granted literature
- US20170098577A1 METHOD OF OPTIMIZING WIRE RC FOR DEVICE PERFORMANCE AND RELIABILITY Public/Granted day:2017-04-06
Information query
IPC分类: