Invention Grant
- Patent Title: Solder stud structure
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Application No.: US14208675Application Date: 2014-03-13
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Publication No.: US09997482B2Publication Date: 2018-06-12
- Inventor: Li-Guo Lee , Yi-Chen Liu , Yung-Sheng Liu , Yi-Jen Lai , Chun-Jen Chen , Hsi-Kuei Cheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/00
Abstract:
A semiconductor structure is provided. The semiconductor structure includes a first substrate and a metal pad formed over the first substrate. The semiconductor structure further includes a solder stud formed over the metal pad, and the solder stud has a flat top surface parallel to a top surface of the first substrate.
Public/Granted literature
- US20150262954A1 SOLDER STUD STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-09-17
Information query
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